Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by Xing-Chang Wei
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging Download PDF
Picture Of The Book;
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging Download PDF
Picture Of The Book;
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging PDF
A high-speed circuit is the base of contemporary information and communication
technology (ICT) and consumer electronics. Our modern life is heavily dependent
on the functioning of high-speed circuits developed for various purposes. Therefore,
the electromagnetic compatibility (EMC) among various circuits becomes very
important. Because of ever-increasing clock frequencies and their harmonics, the
electromagnetic field spectrum on the printed circuit board (PCB) and inside
the electronic package extends to several tens of gigahertz. With decreased wave-
lengths, the electromagnetic wave phenomenon on the PCB and inside the package
is obvious. This makes the signal spread over the entire PCB and package instead
of confirming along the traces. At the same time, the three-dimensional integra-
tion including the through silicon via (TSV) based system-in-package (SiP) greatly
increases the circuit density and complexity. Such a high frequency and a high
density become a big challenge for the EMC control of high-speed circuits.
This book presents EMC modeling and control methods based on the author’s many years’ of research. The emphasis of this book is placed on two essential passive components of a high-speed circuit: the power distribution network and the signal distribution network. The field-circuit hybrid modeling and simulation methods of these passive components are discussed in detail. In addition, this book also explores the applications of novel structures and materials, including highimpedance surfaces and graphene films, in the EMC design, where the traditional bulk EMC materials cannot be used.
This book provides a detailed description of electromagnetic modeling of EMC problems. The author hopes that this book will serve as a basis for further advances in the high-speed EMC circuit for both academic research and industrial applications
With decreased wavelengths, the electromagnetic wave phenomenon on the PCB and inside the package is obvious. This makes the signal spread over the entire PCB and package instead of confirming along the traces. At the same time, the three-dimensional integration including the through silicon via (TSV) based system-in-package (SiP) greatly increases the circuit density and complexity. Such a high frequency and a high density become a big challenge for the EMC control of high-speed circuits.
Our modern life relies heavily on the work of high speed circuits developed for various purposes. Therefore, electromagnetic compatibility (EMC) between different circuits becomes very important. Due to increasing clock frequencies and harmonics, the electromagnetic field spectrum extends on the printed circuit board (PCB) and inside the electron beam to several tens of gigahertz.
Content Of The Book;
1 Electromagnetic Compatibility for High-Speed Circuits
2 Modal Field of Power–Ground Planes and Grids
3 Integral Equation Solutions
4 Extraction of Via Parameters
5 Printed Circuit Board-Level Electromagnetic Compatibility Design
6 Interposer Electromagnetic Compatibility Design
7 New Structures and Materials
Information Of The Book;
Book Format : PDF
Language : English
Page :341
Size : 12.04 MB
To Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by Xing-Chang Wei